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Awards

Authority
  1. 2023, Nominated Award for ENI AWARD

  2. 2021, Best Paper Award from IEEE ICPADS

  3. 2021, IEEE Outstanding Service Award of International Workshop on AI-driven Network in conjunction with IEEE International Conference on Trust, Security and Privacy in Computing and Communications (IEEE TrustCom) 

  4. 2020, Best Paper Runners-up Award from IEEE MultiMedia for 2019

  5. 2019, IEEE Outstanding Service Award of International Workshop on Machine Learning assisted Smart System (MLSys) in conjunction with IEEE International Conference on Ubiquitous Computing and Communications (IUCC)

  6. 2018, EU H2020 EPIC - Expert Visits Award

  7. 2017, Outstanding Reviewer Award, Elsevier Future Generation Computer Systems

  8. 2016, Outstanding Reviewer Award, Elsevier Computer Networks

  9. 2014, Outstanding Reviewer Award, Elsevier Ad Hoc Networks

Eminence

  1. 2024 - Present, Chartered Engineering of Institution of Engineering and Technology (IET)

  2. 2024 - Present, Fellow of Institution of Engineering and Technology (IET)

  3. 2023 - Present, Fellow of Royal Society for the Encouragement of Arts, Manufactures and Commerce

  4. 2022 - Present, Fellow of British Computer Society (FBCS)

  5. 2021 - Present, Senior Member of Institute of Electrical and Electronics Engineers (IEEE)

  6. 2021 - 2024, Member of Institution of Engineering and Technology (IET)

  7. 2019 - Present, Fellow of Higher Education Academy (FHEA)

  8. 2022-2023, 2021-2022 Highly Cited Chinese Scholar with Subject of Cyber Security (Ranked by Elsevier and ShanghaiRanking)

  9. 2020 - 2022, World's Top 2% Scientists for 2019 - 2021 single year impact (Ranked by Stanford University)

  10. 2016 - 2021, Member of Institute of Electrical and Electronics Engineers (IEEE)

  11. 2016 - 2019, Associate Fellow of Higher Education Academy (AFHEA)

Appearance

  1. 2022-2023,Lecturer for China Education Development Foundation & Volkswagen funded-[Youngth Innovation+]

  2. 2014, Personal case study for online and printed marketing materials released from University of Surrey, UK: Link

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